The News
Chiplet Summit has announced that Yole Group will return as its market research partner for the fourth annual event, taking place February 17-19 at the Santa Clara Convention Center. Yole Group will provide market analysis and trend predictions for the chiplet and memory markets, with a particular focus on High Bandwidth Memory (HBM). Simone Bertolazzi, Principal Market/Technology Analyst Memory at Yole Group, will present on “HBM Markets” and participate in a panel discussion on “HBM Interfacing in 2031 and How We Got There.” Yole Group will also lead an expert table, participate in the closing panel, showcase research services in the Exhibit Hall, and offer a tribute to founder Jean-Christophe Eloy. The partnership underscores the critical role of market intelligence in guiding chiplet design decisions as the technology gains traction with major chipmakers including AMD, Samsung, and Marvell.
Analyst Take
Accelerating Time-to-Market in the AI Era
Chiplet technology transforms Day 0 design economics by enabling modular architecture approaches that reduce development cycles and manufacturing costs. In the AI era, where compute demands are escalating and time-to-market determines competitive advantage, chiplets allow designers to incorporate off-the-shelf IP, proven work from older process nodes, and specialized analog circuits without redesigning entire systems. This modular approach mirrors broader trends we’re seeing in application development, where composability and reusability drive faster innovation cycles. For organizations building AI infrastructure, chiplet-based designs offer a path to customize compute, memory, and interconnect components while avoiding the prohibitive costs and timelines associated with monolithic chip development.
Memory Bandwidth as the AI Infrastructure Bottleneck
Yole Group’s focus on HBM markets reflects one of the most critical constraints in modern AI workloads: memory bandwidth. Our research consistently shows that AI infrastructure cost and performance optimization are top priorities for enterprises deploying machine learning and AI systems. HBM technology addresses the memory wall problem by providing significantly higher bandwidth between processors and memory, enabling faster training and inference for large language models and other data-intensive AI applications. The panel discussion on “HBM Interfacing in 2031” signals that memory architecture will remain a key differentiator in chiplet designs, particularly as AI models continue to grow in size and complexity. Organizations evaluating AI infrastructure should pay close attention to HBM roadmaps and chiplet integration strategies.
Market Intelligence Driving Design Decisions
Chuck Sobey’s emphasis on the importance of current market research for chiplet designers highlights a fundamental shift in semiconductor development. Designers must now balance technical feasibility with real-time market demand signals, customer feature requirements, and competitive positioning. This intelligence-driven approach to Day 0 design aligns with the broader trend of data-informed decision-making across the technology stack. Yole Group’s forward-looking view of the semiconductor market, supported by extensive research, provides the strategic context that chiplet designers need to make architectural decisions that will remain relevant through multi-year development cycles. In fast-moving markets like AI, where customer requirements evolve rapidly, this market intelligence becomes as critical as technical specifications.
Ecosystem Maturation and Industry Standardization
The fourth annual Chiplet Summit represents a maturing ecosystem where standardization, interoperability, and supply chain considerations are becoming as important as raw performance metrics. Major chipmakers like AMD, Samsung, and Marvell adopting chiplet technology points to a shift from experimental to production-ready implementations. This ecosystem maturation parallels what we’ve observed in cloud-native infrastructure, where early innovation phases give way to standardization and broad adoption. For enterprises building AI systems, a mature chiplet ecosystem means more vendor options, better interoperability, and reduced risk in long-term infrastructure planning. Yole Group’s continued partnership with the Summit provides the market visibility needed to track this ecosystem evolution and identify emerging leaders in chiplet technology.
Looking Ahead
As AI workloads continue to drive unprecedented demand for specialized compute and memory architectures, chiplet technology will play an increasingly strategic role in semiconductor roadmaps. The focus on HBM interfacing through 2031 suggests that memory bandwidth will remain a critical bottleneck, and chiplet designs that optimize data movement between compute and memory will command premium positioning. We expect to see continued innovation in chiplet interconnect standards, thermal management solutions, and heterogeneous integration techniques that combine different process nodes and materials on a single package.
The Chiplet Summit’s emphasis on market research reflects a broader recognition that technical innovation alone is insufficient and that successful chiplet strategies require deep understanding of customer needs, competitive dynamics, and long-term market trends. Organizations evaluating AI infrastructure investments should monitor chiplet developments closely, particularly in HBM integration and multi-die architectures that can deliver better performance-per-dollar than monolithic designs. Yole Group’s research will provide visibility into which chiplet approaches are gaining traction and where the market is heading, helping enterprises make informed decisions about their next-generation AI infrastructure.
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